电子封装

电子封装用Sip/Al复合材料的研究应用进展

Progress in Research and Application of Si_p / Al Composites for Electronic Packaging

图像处理技术是电子封装设备（如无线射频识别（RFID：RadioFrequencyIdentification）封装设备）开发的关键技术。

The image processing technology is one of the critical technologies in the electronic packaging equipments such as Radio Frequency Identification ( RFID ) equipments .

系统封装（SystemInPackaging）是电子封装工艺的前沿技术。

System In Packaging SIP is a brand-new technology of electronics packaging .

电子封装Cu键合丝的研究及应用

Research and Application of Copper Bonding Wire in Electronic Packaging

电子封装SiCp/Al复合材料导热性能研究与进展

Research and Development on Thermal Conductivity of SiC / Al Composites Applied to Electronic Packaging

电子封装用高体积分数SiCp／Al复合材料的制备

Preparation of high volume fraction SiCp / Al composites for electronic packaging

概述了影响电子封装PCB结构的技术推动力。

This paper summarizes the technology drivers that impact packaging and PCB structures .

电子封装失效分析新技术&双波透射SAM

New Failure Analysis Technology for Microelectronics Packaging-Double Transmission SAM

电子封装用SiC颗粒增强铝基复合材料离心铸造成形工艺研究

Study on Centrifugal Casting Process of the SiC Particle Reinforced Aluminum Matrix Composites for Electronic Packaging

一种新型电子封装材料70%SiAl合金通过喷射沉积技术被开发出来。

A novel electronic packaging material , silicon-aluminium alloy ( 70 % Si-Al ) has been developed using spray deposition technique .

倒装焊电子封装底充胶分层研究PCB分层设计中控制电磁干扰辐射

Research of underfill delamination of flip chip Restraint of Electromagnetic Interference from PCB Delamination Design

退火工艺对轧制复合CPC电子封装材料性能的影响

Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material

PPS高性能电子封装材料的研制

Study on High Performance Poly ( Phenylene Sulfide ) Materials for Electronic Encapsulation

5S管理在电子封装企业中的应用

The Application of " 5S " Activity in Electronic Packaging Industry

界面SiO2层对SiC/Al电子封装材料热膨胀系数的影响

Influence of Interface on the Coefficient of Thermal Expansion of SiC / Al Electronic Packaging Composite

等离子喷涂W-Cu电子封装材料的组织与性能

Microstructure and properties of W-Cu electronic packaging materials by plasma spraying

本文结合各个时期电子封装的特点，介绍了封装CAD技术的发展历程，并简要分析了今后发展趋势。

With the feature of the electronic packaging in different steps , the development of the electronic packaging CAD were discussed and the trend was chiefly analyzed in this paper .

设计了混杂C/SiCp预制型中碳化硅颗粒的尺寸及体积分数，并用低压浸渗技术制备了非润湿体系混杂2DC/Al电子封装复合材料。

The size and volume fraction of silicon carbide particle in hybrid C / SiC_p per-form were designed , and hybrid 2D-C / Al electronic packaging composites of non-wetting system were fabricated by low pressure infiltration .

本文提出了一种大批量层叠封装（PoP）组装方法，这种方法利用了倒装芯片组装中已有的电子封装技术。

This article proposes an approach to high volume Package-on-Package ( PoP ) assembly that leverages the existing electronics packaging technologies for flip chip assembly .

退火工艺为900℃/1.5h时，CPC电子封装材料的综合性能最好。

The CPC electronic packaging materials have the best integrated properties when annealed under the temperature of 900 ℃ for 1.5 hours .

压制压力对Si-Al电子封装材料性能的影响

Effect of Pressing Pressure on Properties of Si-Al Electronic Packaging Materials

Invar合金电子封装零件的制备及性能

Preparation and properties of Invar alloy parts for electronic package

热压法制备Si-Al电子封装材料及其性能

Properties of Si-Al Electronic Packaging Materials Fabricated by Hot Pressing

喷射成形电子封装Si-Al合金凝固过程模拟研究

Simulation of Solidification Behavior in Spray-deposited Si-Al Preforms Used for Electronic Packaging Materials

DBC电子封装基板研究进展

Research and Development of DBC Packaging Materials

研究了粉末注射成型技术生产Invar合金电子封装零件的工艺。

The electronic package parts of Invar alloy were prepared by powder injection molding .

系统地介绍了电子封装中所涉及的各种电子电镀技术，并阐述了IC引线框架及无铅化电镀技术方面的应用情况、存在问题及今后的发展趋势。

Various electronic electroplating technology in electronic packaging were systematically discussed . Moreover , the applications , existing problems and development trends of IC lead-frame and lead-free electroplating technology were illustrated .

新型电子封装Si-Al合金的基础研究

Fundamental study of new Si-Al electronic packaging materials

经过细化的粉石英、硅微粉、白炭黑等微米甚至纳米级SiO2更是在橡胶补强、紫外屏蔽、电子封装材料等化工领域应用广泛。

Refined , quartz and silica powders , white carbon and nano-SiO2 have been widely used for rubber reinforcement , UV shielding and electronic packaging materials .

微波通信的高频化对微波材料和电子封装陶瓷提出了很高的要求：高的Q·f值和不同的介电常数ε。

The development of high - Q microwave dielectric ceramics with various ε has been required with the advanced wireless communication systems , which include mobile and satellite communication systems , have developed .