镀
- 动plate;overlay
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用电解等化学方法使一种金属附着在别的金属或物体的表面上,形成薄层:~金。~银。电~。
- [动]
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(用电解或其他化学方法使一种金属附着到别的金属或物体表面上) plate:
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给铜镀银
plate copper with silver;
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那只戒指不过是镀金的。
The ring was only plated (with gold).
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热镀Zn、Al及其合金钢丝有着广阔的应用前景。
It has broad application prospects to plate Zn , Al and alloy steel wire that it is hot .
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选择并制备出了磷酸锆载体,确定了最佳银铜金属离子比,制备出了抗菌粉体材料和抗菌陶瓷,用溶胶-凝胶法和浸渍提拉法在抗菌陶瓷表面镀一层TiO2薄膜。
The best ratio of silver and copper is found , and with this ratio a kind of antibacterial materials were prepared . After we get the antibacterial ceramics , plate a thin film of TiO_2 using the sol-gel law in the surface of them .
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他们最神圣的教堂屋顶镀了金。
The holiest of their chapels are topped with gilded roofs
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整个表面都镀了一层银。
Silver overlay is bonded to the entire surface .
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把姓名刻上去,再镀上金。
Carve the names and gild them .
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Ni基体磁控溅射离子镀Al膜的电镜观察
TEM observation of ion-plated Al film on Ni Substrate
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电弧离子镀技术中脉冲偏压对TiN薄膜的影响
Effects of Pulse Bias on TiN Coating in Arc Ion Plating
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高速钢刀具多弧离子镀TiN涂层研究
Study of Multi-Arc Ion Plating TiN Films on High Speed Steel Tools
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研究了镀液中YD1对电沉积NiFe合金微观结构的影响。
The effects of YD-1 on the microstructure of electrodeposited Ni-Fe alloy are studied .
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NdFeB烧结永磁体化学镀NiP的新工艺和组织结构的研究
The Study of New Technique and the Structure of Chemical Plating Ni-P of Sintering Permanent Magnet Nd-Fe-B
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心排血量(CO);化学镀钴-磷合金
Electroless Co - P Alloy Plating
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离子镀TiN膜织构的研究
Study of Texture for TiN Coating by Ion Plating
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镀碳氢膜PET的阻隔性能在标准透水蒸气测试仪上进行检测。
The barrier property of the film was conducted on the water vapor permeation instrument .
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研究了化学镀Co-P合金镀层中磷含量与工艺条件的关系及产生非品结构的成分条件。
The relation between phosphorus content and the electroless CoP alloy plating conditions to form amorphous structure has been investigated .
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Ni镀液有机添加剂结构与整平性能的关系
Studies on relation between structure of organic additives and their leveling property for Ni electroplating
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研究了在碳纳米管表面化学镀Ni的新方法。
A new method of coating of carbon nanotube with electroless plating of nickel is proposed .
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Gr/Al复合材料表面镀覆双层金属黑色钝化膜的工艺研究
Study of double layer passivation black coating on Gr / 6061Al composite surface
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PCB镀通孔疲劳寿命对设计参数的灵敏度分析
Sensitivity Analysis for the Dependence of PTH Fatigue Life on PCB Design Parameters
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本文采用脉冲电弧离子镀的方法,在p型硅上沉积类金刚石薄膜,用椭偏法测试薄膜的光学常数。
Optical properties characterization with ellipsometry of the diamond-like carbon films , grown on p-type Si substrate by pulsed arc deposition , has been successfully developed .
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利用脉冲碳等离子体源可以直接在Si和Ge片镀制类金刚石薄膜。
Diamond-like carbon films were directly deposited onto germanium and silicon by pulse discharge carbon plasma source .
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研究了含双络合剂化学复合镀(Ni-P)-PTFE的工艺过程。
The technological process of ( Ni P ) PTFE electroless composite plating with two complexing agents has been studied .
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镀C材料的微动接触电阻值远高于镀金材料的电阻值,低接触压力下镀C材料的微动接触电阻不稳定。
Contact resistance of carbon-plated material is much higher than that of gold plated materials . Low contact force will result in unstable resistance of C-plated material .
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用镀Ti金刚石制成的铜基合金磨块对花岗岩的磨削比与不镀钛金刚石相比提高30%。
The grinding ratio of samples made from Ti-clad diamond is 30 % higher than that without clad diamond .
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不锈钢双极板电弧离子镀Cr(1-x)Nx薄膜改性研究
Research of modification of stainless steel bipolar plates with cr_ ( 1-x ) n_x films deposited by arc ion plating
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(Ni-P)-SiC复合电刷镀
( Ni - P ) - SiC Composite Brush Plating
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高耐蚀性的双层化学镀Ni-P合金镀层
High Performance Corrosion Resistance Double Layer Chemical Ni-P Alloy Plating
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电刷镀含纳米SiC粉复合镀层的EPMA分析
EPMA Analysis of Brush-plating Ni / nano-SiC Composite Coating
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研究Ni-P-纳米SiO2化学复合镀工艺配方。
Basic formula of electroless Ni-P-SiO_2 composite plating was investigated .
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稀土钇改性离子镀Ti(Y)N膜与A3钢基材界面的结构特性
Microstructure of interface between Y - modified ion plated ti ( y ) n coating and substrate steel A3
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铝-镁合金材料磨损后刷镀Ni-P合金工艺
Technology of Ni-P Alloy Brush Plating on Worn Material of Aluminium Magnesium Alloy