热压焊

  • 网络Thermal Compression Bonding;hot pressure welding;hot bar;HPW
热压焊热压焊
  1. 本文首先介绍精密热压焊系统的组成结构及工作原理,然后阐述了控制系统的硬件构成及软件系统。

    Firstly , this paper introduces the structure and working principle of precision hot pressure welding system , then the hardware and software of control system is introduced .

  2. 广泛应用于线材的热压焊、焊锡焊接的回流焊,IC贴片。

    HOT BARThe hot wire is widely used in welding , solder reflow soldering .

  3. 浅谈电厂化学水处理系统膜处理装置的安装微处理曝制的热压焊装置

    On installation of membrane treatment equipment of chemical water treatment system in power plant

  4. 一种硅芯片外引线键合的热压焊简易装置

    A Novel Instrument of Thermocompression Wire Bonding

  5. 微处理曝制的热压焊装置导弹半筒压力焊接系统中托架变形及处理方法研究

    The Research of the Bracket Deformation and Processing Method in Pressure Welding System of Missile Semi-Cylinder

  6. 摩擦焊是一种现代的固相热压焊技术,具有焊接效率高、节能等优点。

    Friction welding is a modern solid phase pressure welding technique , which has the characters of high efficiency and energy-saving .

  7. 为满足压阻式压力传感器封装工艺中硅芯片外引线键合的要求,研制了热压焊简易装置;

    In piezoresistive pressure sensor packaging process , the thermocompression wire bonding was studied to meet the outer interconnection of silicon gauge .

  8. 扩散硅芯片内引线采用高掺杂浓度导电带,外引线用金丝,热压焊和超声焊相结合,保证接点有良好的导电性能。

    The chip is inner - connected with heavily doped conduction belt and external-connected with gold wire by the combination of hot welding and ultrasonic welding which ensures good conducting propertes at contacting dot .

  9. 工作原理是通过XY工作台和焊头的三维运动控制,定位并拉出设定的金丝线型,采用超声波热压球焊方法焊接芯片管脚。

    By controling three-dimensional motion of the X-Y table and bond head , precision positioning and desired line-type gold wires can be realized , and an ultrasonic wave bonded method is used .

  10. 采用弹塑性有限元方法,计算了以纯铝为中间层材料,通过真空热压扩散焊获得的Si3N4/金属接头中的残余热应力分布。

    The residual thermal stress distribution of the Si 3N 4 / Metal vacuum diffusion bonding tip which uses pure aluminum as interlayer was calculated by the method of elastoplastic FEM .

  11. 热压超声倒装焊工艺研究

    A Study on the Process of Thermocompression Ultrasonic Flip Chip