负性光刻胶

环氧基紫外负性光刻胶的特性、应用工艺与展望

The properties , application processing and Prospect of epoxy-based negative photoresist SU-8

环氧基负性光刻胶加工微结构的试验研究

Fabrication of micro-structure by using epoxy-based negative photoresist

以钛酸丁酯和苯甲酰丙酮为原料，经SOLGEL工艺，获得具有负性光刻胶性质的TiO2光敏凝胶薄膜。

TiO_2 photosensitive gel films are derived from chemically modified metal-alkoxide with benzoylacetone by sol-gel process .

SU-8胶是一种化学放大的、基于环氧基的负性光刻胶。

The SU-8 photoresist is a chemically amplified , epoxy based negative resist .

SU8系列负性光刻胶是一种新品光刻胶，它具有良好的光敏性和高深宽比，适合于微机电系统，UVLIGA和其它厚膜、超厚膜应用[1,2]。

SU-8 series photo resist is a new epoxy-negative-tone resist product . It has good light sensitivity and high aspect ratio . It is suited to application in MEMS system , UV-LIGA and other thick and ultra-thick films .

本文介绍了采用302负性光刻胶刻制光学度盘的工艺方法。

This paper introduces a technical method of etching optical dividing disc with 302 ~ # negative type photoresist .