系统封装

某系统封装产品的热仿真分析

Thermal Simulation Analysis of a SIP

系统封装（SystemInPackaging）是电子封装工艺的前沿技术。

System In Packaging SIP is a brand-new technology of electronics packaging .

在详细设计部分，着重阐述了开发的网络考试系统封装成GridService的模块的设计过程。

Then the design process that net examination system are encapsulated to GRID SERVICE is described .

敏捷供应链中基于多代理的Legacy系统封装技术

Multi-Agent Based Legacy System Encapsulation in Agile Supply Chain

本文提出了企业应用集成的体系结构，研究了企业应用集成的工作流技术、XML技术、可靠消息传递技术和Legacy系统封装技术等关键技术。

The architecture of EAI is introduced . The key technologies of EAI consist of the workflow , XML technology , reliable delivery message and Legacy system wrapper .

开发USB（universalserialbus，通用串行总线）驱动程序是一项比较繁琐和复杂的工作，虽然Linux下的USB核心子系统封装了大部分的复杂性，并提供了相应的支持机制。

USB ( Universal Serial Bus ) driver development is a cumbersome and complex task . Linux , the USB core subsystem encapsulates the most complex , and provides appropriate support mechanisms .

通过将异构数据转换系统封装为一个Web服务，使得用户能够透明的访问异构数据转换平台，调用转换应用。最后，本文对系统进行了转换功能测试和Web服务测试。

The system allows users to transparently access heterogeneous data conversion platform and call the conversion application by encapsulating the heterogeneous data conversion system to a web service . Finally , the system conversion function test and web services test are implemented in this thesis .

嵌入式操作系统封装层中内存管理封装的设计

Design of Memory Manage Encapsulation in Embedded Operating System Encapsulated Layer

高密度封装进展之五&采用无源元件和有源元件埋入技术实现的模块内系统封装

System in Module Using Passive and Active Components Embedding Technology

电子系统封装器件的传热研究

An Investigation into Heat Transfer of Electronic System Packaging

系统封装技术及发展

The Technology and Developmant of System in Package

应用于微系统封装的激光局部加热键合技术

Laser locally heating and bonding for microsystem packaging

用于微电子机械系统封装的体硅键合技术和薄膜密封技术

Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

在已有的各种嵌入式系统封装层的基础上，建立企业级的嵌入式软件开发平台不仅符合嵌入式软件技术的发展方向，而且意义重大。

It is very important to construct embedded software platform , which accords with embedded software technology development direction .

COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。

The COF / MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency ( RF ) devices .

在嵌入式应用软件开发平台的开发过程中，如何进行面向对象化的操作系统封装对系统的性能有很大的影响。

In the developing of developing platform of embedded application , it is very important to the performance of system that how to encapsulate object-oriented operating system .

您不需要将虚拟机系统封装到单独的表中，但是如果您这么做，是一种值得建议的好的建模实践操作，因为它可以使拓扑架构变得独立与瘦小。

You don 't have to encapsulate virtual systems into separate diagrams , but doing so is generally good modeling practice because it keeps your topologies independent and small .

完成系统封装后进行相关车载实验，实验结果表明测速系统的测速误差精度与速度更新率均符合要求。

Make a in-car experiment when after packaging of system , the results of experiment show that the speed measuring precision and speed update rate all meet the requirement .

键合技术是微系统封装的基本技术之一，经过近20年的快速发展已经成为微机电系统领域里的一项重要工具。

With rapid development for recent 20 years , wafer bonding has become the basic technology in MEMS ( Micro-Electro-Mechanical System ) packaging and an important tool in MEMS engineering field .

声-振动传感器在国防等领域有重要的应用前景，封装材料与结构在系统封装中起着关键作用。

The sensor – vibration sensors system has a bright and broad application prospect in the military field , and its package material and structure play key parts in the system packaging .

企业应用实践表明：以PDM/iMAN及ANSYS/WorkBench为核心软件进行系统封装，可以满足企业信息集成和共享的需求，实现产品开发过程的协同工作。

The application results show that the encapsulated system by PDM / iMAN and ANSYS / WorkBench can satisfy demands of integration and share of enterprise information , and implement product collaborative development .

晶片级封装、系统封装、芯片级封装是现在第三次革新的产物，其目的就是将封装减到最小。

We are on third step now , many companies are developing Chip Scale Package ( CSP ) System In Package ( SIP ) , Wafer Level Scale Package ( WLSP ) etc to get the highest density .

重点解决了协同规划、协同联盟成员选择与匹配、信息交换、访问控制、协同过程管理控制、系统封装以及通信等方面的问题；

Some key problems of the networked manufacturing collaboration alliance were solved , such as collaborative planning , selection and matching of collaborative partners , information exchange , access control , collaborative process management and control , systematic encapsulation , and communication , etc.

NET平台实现了其中的主要构件，即用WEBService将遗产系统分层封装为服务组件。

NET in Windows . This is layered packaging Legacy System as Service Conponent with Web Service .

系统级封装（SIP）技术及其应用前景

Technology of System in Package and Its Applications Prospects

系统级封装（SiP）的随机振动分析

System-in-Package ( SiP ) Random Vibration Analysis

同时，文中还提供了对一类Legacy系统的封装方法，以提高软件的重用性。

In addition , an approach of encapsulation for a kind of legacy systems is proposed to enhance the software reusability .

在MATLAB环境下，应用S函数实现单神经元PID控制器子系统的封装，建立了张力控制系统仿真模型。

Under MATLAB environment , the subsystem package of single neuron PID controller is accomplished by using S function , and the simulation model of tension control system is established .

应用程序层利用WEBService激活远程应用程序，事务层利用WEBService转发方法的调用，数据层在WEBService中访问遗留数据库系统并封装新的业务逻辑。

In application program layer using Web Service invoke remote application program . In transaction layer using Web Service transmit method invocation . In data layer we access database in Web Service and also write some business logical in it .

系统级封装（SIP）寄生效应小、集成度高的优点特别适合用来封装RF-MEMS系统。

The SIP ( system in a package ) with lower parasitic effect and higher integration satisfy the RF-MEMS system .