等离子清洗

等离子清洗在LED封装工艺中的应用

Application of Plasma Cleaning in LED Package Process

等离子清洗工艺对PBGA组装可靠性的影响

Effect of the Plasma Cleaning Process on Plastic Ball Grid Array Package Assembly Reliability

在特定情况下，MYCRO等离子清洗机可以改变材料的表面性质，举例如下。

Under specific conditions , MYCRO Plasma Cleaner is able to change the surface property of material ( s ) Plasma treated , could you please give an an example of it ?

陈述了密封剥离试验、芯片和密封剂拉力试验、焊线拉力试验和C-模式SAM（C-SAM）检查的结果，证明了最佳的等离子清洗工艺会增强PBGA封装的定性等级，并提高工艺效率和生产率。

The results from encapsulation peel tests , die and encapsulant pull tests , bonding wire pull tests and C-Mode SAM ( C-SAM ) examination are presented . This paper demonstrates that the optimized plasma cleaning process would enhance PBGA package qualification level and improve the process yields and productivity .

等离子清洗性能产生氧气等离子体。

The plasma cleaner can form an oxygen plasma .

小型等离子清洗蛐刻蚀机的应用

Application of Small Plasma Cleaning / Etching Instruments

刚挠板等离子清洗去钻污工艺参数的非线性回归分析

Non Linear Regression Analysis of Technological Parameter of the Plasma Desmear Process for Rigid-Flex PCB

等离子清洗技术（二）

Plasma Cleaning Technology ( 2 )

在激光陀螺的密封、抽真空、检漏、等离子清洗等过程中，都涉及到超高真空的获取技术。

The sealing techniques , vacuumizing , leak detection and plasma cleaning all need an ultra high vacuum systems .

通过改变等离子清洗工艺参数、沉积负偏压和打底层，优化类石墨镀层在铝合金基体上的性能。

The GLC coatings were deposited on aluminum alloy by changing plasma cleaning parameter , the deposited bias voltage and different adhesions .

焊料掩膜逸出气体对可焊性具有负面影响，等离子清洗能够有效地去除有机物杂质。

The outgas from the solder mask had a negative influence on the bondability . Plasma cleaning was effective in removing the organic contaminants .

最终产品显示，金属切削刚挠结合区通孔，等离子清洗通孔等实验的结果大大地提高金属化孔的可靠性。

The final product showed that the experiment results from drilling and plasma desmear through-hole in rigid-flex zone greatly improved the reliability of metallized through-holes .

研究结果表明，使用等离子清洗的焊片可显著提高抽真空速率，并减少气泡，降低空洞率；

The results show that the vacuum pumping rate is increased and the void ratio is decreased obviously using solder sheet and plasma cleaning technology .

用于等离子清洗纤维表面，从而改变纤维表面性性质，提高纤维的性能。

He wants to plasma clean the surfaces of fibers in order to change the surface properties and further improve the performances of the fibers .

工艺建立完成后，通过分批实验和批量试生产来验证加入等离子清洗后降低硅片缺陷数及提升良品率的效果。

After process setup completion , split experiment and risk mass production are required to verify the benefit of defect reduction and yield improvement via bevel clean insertion .

大型等离子轰击清洗设备中的PLC控制系统构建

PLC Control System Built in Large Plasma Bombardment Cleaning Device

等离子茶叶果蔬清洗机对以上的清洗可达到清洁、无毒、无味、安全可靠。

Plasma tea fruit and vegetable washing machine to the above cleaning can achieve clean , non-toxic , tasteless , safe and reliable .

等离子茶叶果蔬清洗机通过等离子臭氧混合途径来破坏有机物分子结构，降解残余农药，清洗污浊，而达到清洁无毒作用。

Plasma tea fruit and vegetable washing machine through the plasma ozone mixing way to destroy organic molecular structure , residual pesticide degradation , wash dirty , and achieve clean non-toxic role .