球焊

金丝球焊质量控制的探讨

Discussion of quality control of gold wire ball bonding

这些工作的开展有利于提高金丝球焊的焊接质量。

Development of these work is of benefit to raising quality of gold wire ball bonding .

Cu丝超声球焊及楔焊焊点可靠性及失效机理研究

Research Status of Reliability and Failure Mechanism of Ultrasonic Ball and Wedge Bonding With Copper Wire

工作原理是通过XY工作台和焊头的三维运动控制，定位并拉出设定的金丝线型，采用超声波热压球焊方法焊接芯片管脚。

By controling three-dimensional motion of the X-Y table and bond head , precision positioning and desired line-type gold wires can be realized , and an ultrasonic wave bonded method is used .

最后，本论文研究了USB四层堆叠球焊工艺，探讨了工艺参数对叠层球焊工艺性能的影响。

Finally , the process of USB four layer stacked chips was investigated , and the influence of the process parameters on the performance of wire bonding was explored .

铜丝球焊中形球过程的数值模拟

Numerical Simulation of the Ball Forming Process in Copper Ball Bonding

半导体工业用的球焊金丝的代用研究

Development of the Substitute Materials of Ball-bonding Gold Wires for Semiconductor Industry

改善球焊工艺精密铸造特殊球阀

The Method to Improve Welding Technology Special Ball Valve in Investment Casting

超声波金丝球焊线机焊接压力控制系统设计

Design of welding pressure control system for ultrasonic gold wire bonding machine

金丝球焊的工艺质量统计控制

Statistical Quality Control for Golden - Wire Ball - Soldering

铜丝球焊形球过程分析

Analysis for ball forming process during copper wire welding

超声球焊和高速高精度运动定位技术是关键技术。

Ultrasonic wave bond and precision position at high speed are key technologies .

球焊金丝产生断裂的原因及改善加工性能的途径

Fracture Analysis of Ball Bonding Gold Wire and the Way to Improve Processing Function

同时介绍了传感器的压力量程计算方法、装配结构、扩散工艺、低温玻璃封接技术、球焊技术等研究成果，使传感器精度和长期稳定性显著提高。

It introduces the investigations for calculating method of measuring range , diffusion technology , seal of cryogenic glass and spherical welding , etc.

一些研究表明，铜线具有比金线更好的机械性能和电学性能，且价格比金线便宜。这些优势使铜线可代替金线用于一些高引出端、细间距的球焊和楔型焊的半导体器件中。

Some studies have shown that copper wires may serve as a viable , cost-effective alternative to gold in some high-end , ball and wedge bonding applications .

通过实验，探索出了合适的贴装方式（183℃焊膏贴装）和管芯键合工艺（直径18μm的金丝球焊）。

Trough the experiment , we probed to the suited mount method ( mount with 183 ℃ soldering paste ) and bonding technique ( Ball bonding with the gold silks of 18 μ m in diameter ) .

对铜丝球键合焊形球过程FAB参数进行了优化。

The parameters of FAB ( free air ball ) process during copper wire bonding were optimized .

激光重熔PBGA钎料球与Au/Ni/Cu焊盘的界面反应

Interfacial reaction between PBGA Solder ball and au / ni / cu pad during laser reflow

球型储罐焊后整体热处理自动控制设备送风系统的设计与实验

Design and experiment of wind path system the automatic control equipment of abort whole past-weld heat treatment of spherical tanks

研究了焊粉导致焊料球（回流焊过程中残留在焊点周围的微小珠状焊料）产生的3个因素：氧化度、粒度以及焊粉中是否添加抗氧化元素。

Three factors of inducing solder ball ( Minuteness solder ball remaining around weld spot in the course of refluence soldering ) solder powders : oxidation extent , granularity and appending another element to resist oxidation weather or not were studied .

采用模拟焊接热循环方法，研究奥氏体区不同热循环对奥贝球铁缩孔焊补热影响区（HAZ）显微组织、抗拉强度、冲击韧性和断口形态的影响。

The effect of the different thermal cycling simulations on the microstructure , fracture strength ( σ o ), impact toughness ( α k ) and fracture morphology of heat affect zone of austempered ductile iron are investigated by means of the welding thermo simulation test .

球栅阵列倒装焊封装中的热应变值的测试

Measuring Method in Thermal Strain of Flip Chip Package with Solder Joints

球墨铸铁件焊补电站耐热铸钢件冷补焊工艺综述

Special Column for Metal and Welding A Summary of Patching Up by Cold Welding Technique Heat Resistant Cast Steel Pieces Used in Power Plants

在本文中，首先根据单位温度加载的分析结果将焊球分为关键焊球与非关键焊球两组，对非关键焊球使用静态子结构法进行静凝聚，然后再进行温度循环分析。

In this paper , the solder joints are divided into two groups according to analysis with unit temperature load . Non-critical solder joint was condensed by performing static substructure method .

在一定温度范围内提高激振频率，降低钎料熔融温度或射流压强，有利于射流均匀断裂，减小钎焊球直径，提高焊球质量。

So reducing the melting temperatures or jet pressures , and increasing the vibration frequency are propitious to jetting liquid rupture equably . The diameters of the solder balls become smaller and smaller , and the quality of solder balls become better and better .