焊料

焊料中铟的最佳含量wIn为0.027%。

The optimal indium content in the solder is 0 . 027 % .

ICP-AES法测定铜基焊料中的Si，Fe，B

Determination of Si , Fe , B in Copper - based Solder by ICP-AES

测定了不同成分的焊料与SiC基体的接触角。

The contact angle is determined by high temperature photography .

功率管用Pb基软焊料微观组织和焊接性能研究

Microstructure and Soldering of Pb-Base Solder for Powder Device

SiC陶瓷连接工艺及焊料反应产物研究

Study on the Joining Process of SiC and the Reaction Products of Filler

焊料键合实现MEMS真空封装的模拟

Simulation of Vacuum Package for MEMS Devices with Solder Bonding

PbO-ZnO-B2O3玻璃和合成β-锂霞石的复合焊料玻璃性质

Properties of Solder Glass Composites Consisting of PbO-ZnO-B_2O_3 Glass and β - Eucryptite

结果表明，添加稀土w（Ce）为1%焊料合金的导电性明显提高；

The results show that conductivity property of addition ce solder alloy is enhanced obviously ;

铅锡焊料中杂质元素的ICP-AES测定

Determination of trace impurities in tin - lead solders by ICP - AES

ICP-AES测定镍基焊料中的磷

Determination of Phosphorus in Nickel Matrix Solder by ICP-AES

典型Sn基焊料凸点互连结构电迁移异同性

Electromigration of Typical Sn - Based Solder Bump

利用Al2O3-CaO-BaO-SrO系氧化物玻璃焊料，将透明氧化铝与金属铌连接在一起。

The translucent alumina-niobium seal was formed by the glass solder method . The solder glass belongs to the Al_2O_3-CaO-BaO-SrO system .

本文通过实验证明，Ag可以在In焊料表面形成保护层。

Ag protect layer can be formed on the surface of indium solder has been proved through many experiments .

ICP-AES法测定锡铅焊料中铜铁镉锌铝铋

ICP-AES determination of Cu Fe CD Zn Al and Bi as impurities in tin-lead solder

通过不同的热处理制度以及DSC，纽扣试验等分析手段，对该体系焊料玻璃进行了研究。

The Li_2O-ZnO-SiO_2 system was studied by means of different heat-treatment processes and by DSC and button test .

通过酸溶解试验、基体共存元素干扰实验等，建立了ICP-AES测定镍基焊料中高含量磷的分析方法。

A method was established for determination of main phosphorus in nickel matrix solder by ICP-AES .

当Er含量为0.10%时，焊料铺展面积最大，焊料润湿性有所改善，同时焊料的拉伸强度达到最高；

When Er content is 0.10 % , the spreading area is the biggest and the tensile strength is the highest .

接头区域XRD分析表明，在石墨/焊料界面上几乎全部为TiC，在焊料内部距此界面200μm处仍有部分TiC存在，但主相是纯Ti，还有部分Ti2Ni。

The XRD analysis in the welded area indicates that it is almost TiC in the graphite / solder interface .

Sn-Zn系无Pb焊料

Sn - Zn Series Pb - free Solder

实验结果表明：采用TiCu，TiNi复合焊料可以制备无缺陷的接头，但2种焊料形成液相的过程和机理不同。

Results showed that defect-free joints was fabricated , but the liquid formation processes and mechanism of Ti-Cu and Ti-Ni insert metals were quite different .

随着Er含量的增加，该焊料合金的组织由树枝晶向等轴晶转变，且组织逐渐细化。

With the increase of Er content , the microstructure of the solder changes from fir-tree crystal to equiaxed crystal and is refined .

微量P、Bi、In和Ga元素对Sn-Ag-Sb-Zn系无铅焊料性能的影响

Influence of the property of Sn-Ag-Sb-Zn lead-free solder containing trace P , Bi , In and Ga elements

以Ti、Ag金属粉末压坯做焊料，采用热压反应烧结连接工艺连接再结晶SiC陶瓷。

The joining of recrystallized SiC ceramics was achieved by hot pressing reaction welding using particulate filler composed of Ti / Ag / Ti .

其最佳工艺参数为：熔融焊料温度≤270℃，母材在熔融焊料中的浸渍时间为2～3s。

The best soldering parameters are temperature less or equal to 270 ℃, and soakage time in 2-3s .

已用DSC分析该玻璃焊料，显示在510℃出现主晶相的熔化吸热峰，其开始熔化温度为445℃。

A main thermal absorption peak for melting at 510 ℃ with its beginning temperature 450 ℃ was revealed using DSC instrument .

采用Ni-51Cr焊料高温钎焊SiC陶瓷

Joining of SiC by High Temperature Brazing with Ni-51Cr Filler

镁砂铝矾土、硅粉、硅粉镁砂铝矾土体系焊料可塑性差、分散性差、易固化且与Si3N4陶瓷母材粘附性差；

The slurry properties of the Magnesia & Bauxite adhesive is poor in plasticity and conglutination with Si_3N_4 ceramics , which also solidify easily .

老化对sn-Ag-Cu焊料／Ni-P镀层界面结构和剪切强度的影响

Effects of aging on structures and shear strength of interface of Sn-Ag-Cu solder / Ni-P plating layer

传统的Sn-Pb焊料及其他Pb基焊料除有毒外，还存在力学性能低的问题。

The traditional Sn-Pb solder alloys and other solder alloys based on Pb have lowly mechanical properties except for their poison .

Sn-Ag-Cu焊料中金属间化合物对焊接性能的影响

Effect of the IMC in Sn-Ag-Cu Solders on Soldering Properties