灌封

本文介绍一种大型互感器用灌封材料，研究结果表明：该材料体积电阻率为4.7×1016Ω。

A type of embedment material for large-scale transformer was introduced .

采用PLC的全自动二液灌封机

Twin - Liquid Auto Mixing & Pouring Machine Using PLC

基于BP网络的真空灌封机故障自诊断系统

Vacuum Epoxy Dosing Equipment ′ s Fault Diagnosis System Based on BP Neural Network

选用聚合物H和改性异氰酸酯K为主要原料合成聚氨酯灌封胶。

Polyurethane ( PU ) pouring sealant was synthesized with polymer H and modified isocyanate K as basic materials .

接枝微粒PGMA/Al2O3对环氧树脂电子灌封材料的增强增韧作用

Effect of Grafted Particles PGMA / Al_2O_3 on Toughness and Reinforce of Encapsulating Materials of Epoxy Resin

原位聚合法制备环氧树脂/纳米SiO2灌封材料的性能研究

Study on Properties of Epoxy / Nano-silica Encapsulating Materials Obtained from In situ Polymerization

纳米SiO2/环氧树脂灌封材料的制备和力学性能研究

Study on synthesis and mechanics performance of encapsulating materials based on nano-SiO_2 / epoxy resin

模态分析表明：随着封装管壳内灌封胶弹性模量（E）的提高，封装结构同一振型的模态频率也提高；

Results of the modal analysis showed that tre natural frequency of the same mode increased with the elastic modulus ( E ) of the potting resin .

结果表明：EP灌封胶的热导率随着导热填料用量的增加而增大；

The results showed that the thermal conductivity of EP encapsulating adhesive was increased with increasing thermal conductive fillers contents .

此ADIC生产自动线智能灌封电控系统，采用BP（BackPropagation）神经网络进行故障诊断与监控，从而提高产品生产质量。

This ADIC automated production line intelligent embedding control system using Back Propagation neural networks to diagnostic and monitoring some fault improving the quality of the products .

FBT阻燃环氧灌封料的发展

Progress of FBT flame-retard ant epoxy resin potting compounds

基于BP-NN的ADIC灌封智能电控系统的故障诊断

Fault diagnosis of ADIC Intelligent Pouring Electrical Control System based on BP-NN

动态载荷下等效应力分析表明：芯片粘结胶、芯片及其硅盖板之间封接胶环的等效应力随着灌封胶弹性模量（E）的增加而减小；

Stress analysis under dynamic load showed that the equivalent stress in both the die attachment adhesive and the sealing ring adhesive between the chip and the silicon protective cap decreased with the increase in the elastic modulus of potting resin .

采用真空灌注工艺，制备磨碎玻璃纤维（MG）／聚氨酯（PU）／环氧（EP）灌封材料，并对其力学性能和微观结构进行研究。

Milled glass fiber ( MG ) / polyurethane ( PU ) / epoxy resin ( EP ) encapsulating material was prepared by vacuum priming . The morphology and mechanical properties of the material were studied .

MDI-50在电器灌封胶中的应用研究

Application of MDI - 50 in Encapsulants for Electronics

羟基化合物和环氧基发生扩链反应，降低了固化物的交联度；冲击强度达到25kJ/m~2以上，电性能也得到一定的改善，是较理想的F级灌封材料。

The crosslink density in the cured resin would be decreased by the extension-chains reaction of hydroxyl compound with epoxy group The impact strength has reached 25kJ / m ~ 2 and the electrical property been modified . This epoxy resin is a nice grade F casting material .

对所研制的聚氨酯灌封料理化性能和工艺性能同进口料PU200进行了比较。

The physical , chemical and technical properties of the PUR pouring material developed were compared with that of the foreign PU200 .

以中温硫化硅橡胶（以下简称LTV硅橡胶）为基胶，混入稀释剂、石英粉、链增长剂、交联剂、阻聚剂、炭黑及铂催化剂等组分，制得新型有机硅阻燃灌封料。

New silicone flame retardant potting compound was prepared by blending of LTV silicone rubber as base gum with diluent , crystalline quartz filler , chain extension agent , crosslinking agent , inhibitor , carbon black and platinum catalyst .

研究了某型号产品用两种环氧树脂灌封料（E-4X和828/871/140）在规定环境条件下的使用寿命。

The life of two kind of epoxy resin ( E-4X and 828 / 871 / 140 ) under the special environmental condition was studied in this paper .

结果表明，当采用醇类LAP-101为扩链剂、醇类XSJ-02为活性稀释剂，并且扩链剂和活性稀释剂的比例为1∶5左右时灌封胶的力学性能最好。

The results show that the mechanical properties are the best when using the LAP-101 as the chain extender , XSJ-02 as the diluent and the ratio of them is1 ∶ 5 .

利用E-39D双酚A环氧树脂与酸酐固化剂METHPA、α-Al2O3填料及其他添加助剂，经机械共混固化后可得到具有优异电气性能和耐侯性能的灌封体系。

A casting resin system which has excellent electrical and temperature-impacting resistance properties is got by blending bisphenol A-based epoxy resin ( E-39D ) with curing agent ( METHPA ) ,α - Al_2O_3 fillers and other additive agents .

一步法制备聚氨酯通信电缆灌封胶

Polyurethane pouring sealant for communication cable prepared by one step synthesis

绝缘导热有机硅灌封材料的研制与应用

Researching and Applying of Insulating Heat Conduction Organics Silicon Potting Material

固化剂对酚醛树脂灌封胶性能的影响

The Effect of Curing Agent on Properties of the Encapsulation Adhesive

玻璃纤维填充聚氨酯改性环氧树脂灌封材料的性能

Properties of Polyurethane-Modified Epoxy Resin Encapsulating Materials Filled with Glass Fiber

汽车点火线圈环氧灌封料开裂问题的探讨

Discussion on Dehiscence of Annular Oxygen Filling on Vehicle Ignition Coil

环氧树脂灌封胶的性能预测及配方优化

Prediction of Properties and Optimization of Formula for Epoxy Pouring Sealant

太阳能电池真空树脂薄膜灌封技术的研究

Research on Film Vacuum Resin Dosing Technology Applying in Solar Battery

硅微粉填料对环氧灌封材料性能的影响

The influence of filler on the properties of epoxy encapsulating materials

结构柔韧的环氧树脂灌封隔热材料的研制及其应用

Development and Application of a Tough Epoxy Potting Heat-insulating Material