晶片

本文主要研究的PZT（锆钛酸铅）晶片敏感元就是红外敏感元的一种。

The PZT ( Lead Zirconate titanate ) chip sensitive element researched in this paper is one of the infrared-sensitive elements .

但是当晶片的表面挡在光束中，mot要怎麽作用？

How can one implement a mot when a chip surface gets in the way ?

电路晶片广泛地用于电视、电脑等。

Circuit chips are widely used in the television , computer , etc.

我们也喜欢BASIC晶片编程语言下简单稳健的研发环境。

We also like the simple and robust development environment for the BASIC programming language .

SAW器件晶片在线探测中的边缘效应

The Edge Effect of SAW Wafer in Probe On-line Testing

有朝一日，利用dna晶片作基因比对，在临床应用上将非常重要。

One day gene comparisons performed on DNA chips could prove valuable in medical practice as well .

IC晶片关键尺寸标定的新方法研究

Study on the New Method of CD Calibrating for IC Wafer

TEM观察砷化镓晶片损伤层

Observation of Damage Layer on Surface of GaAs Wafer by TEM

骨架提取在IC晶片缺陷机器视觉识别中的研究

Study of Skeleton Extraction on Machine Vision Recognition of Failures for IC Wafer

WaferDieDisposition：各种与晶片制造及测试相关的功能。

Wafer Die Disposition : Various functions related to wafer manufacturing and test .

研究发现利用金刚石线锯切割大尺寸SiC晶体，可以得到低翘曲度、低表面粗糙度的晶片；

Low-warp and low-surface-roughness SiC wafers sliced by a diamond wire saw were obtained .

高质量的硅晶片是芯片制造和IC发展的基础；

The high quality silicon wafer is the basic of chip manufacturing and IC development .

纳米磨料对GaAs晶片的抛光研究

Study on the Polishing of GaAs Wafer Using Nano-sized Abrasives

超低亚表面损伤层GaAs抛光晶片的工艺

Polishing of Super - Low Sub - Surface Damage of GaAs Wafer

高速类比数位转换晶片因此能同时运用数亿赫兹的RF频谱。

High-speed analog-to-digital conversion chips can thus exploit hundreds of megahertz of RF spectrum simultaneously .

氢离子注入GaAs晶片表面剥离机理

Investigation of GaAs wafer surface blistering by hydrogen implantation

纳米CeO2的醇水法制备及其对GaAs晶片的抛光性能

Synthesis of nano-sized CeO_2 via alcohol-water method and its polishing performance on GaAs wafer

常温下，晶片中的Fe，Ni杂质玷污可产生紫外特征荧光峰。

The results show that some impurities such as Fe and Ni have characteristic peak wavelength at room temperature .

作者利用双晶X射线衍射技术，研究了不同切割速率下硅晶片的切割损伤。

By means of technique of X-ray double crystal diffraction , the different cutting damages of silicon slices have been studied .

红外吸收法测定N型Hg（0.8）Cd（0.2）Te晶片的P型夹杂

Determination of p-type inclusion in n-type hg_ ( 0.8 ) cd_ ( 0.2 ) te alloys by infrared absorption

纳米CeO2磨料对GaAs晶片的CMP性能研究

Study on the CMP Property of GaAs Wafer Using Nano Cerium Dioxide Abrasive

东方钽业4英寸LN晶片的研究开发

Four inch LiNbO_3 wafer process of Ningxia Orient Tantalum Industry

介绍了用X射线双晶及三晶衍射仪检验半导体晶片研磨及抛光损伤的原理及方法。

Methods using X-ray double-and triple-crystal diffractometry for the investigation of lapping and polishing damages in single crystal wafers have been suggested .

SOI晶片制造技术及其应用前景

Progress in the Manufacturing Technology of SOI Wafers and Its Applications

SiC晶片的横向尺寸为0.1～3μm，具有规则多面体外形，显示阶梯状生长侧面。

The platelets have lateral dimensions of 0.1 ~ 3 μ m , exhibiting regular polygonal shapes and step-bunched side surface .

Cd（1-x）ZnxTe晶片中Zn组分的室温显微光致发光平面扫描表征

Characterization of Zn Composition in Cd_ ( 1-x ) Zn_x Te by Room Temperature Micro-Photoluminescence Mapping

斜率传感器装在X向滑板上，而晶片固定在可绕Z轴转动的主轴上。

The slope sensor is mounted on a linear X-carriage and the wafer on a spindle with its rotational axis along the Z-axis .

DSP芯片主要完成控制逻辑信号的产生、外部脉冲信号的采集、晶片谐振频率的计算等工作；

The DSP chip does mainly such works as producing control logical signal and collecting external pulse signal and calculating resonance frequency of crystal flake .

报道了用激光二极管近贴泵浦两表面镀膜的Nd∶YVO4晶片作为激光放大器的一种简单设计。

A LD close pumped Nd ∶ YVO 4 laser amplifier is reported .

CdSe探测器晶片化学机械抛光工艺研究

Study on Chemical Mechanical Polishing Technology for CdSe Wafer for Detectors