多芯片模块

提高功率多芯片模块终测成品率的方法探讨

Methods Discussion on How to Improve Final Test Yield of Power MCM

广泛选择多芯片模块用材料

A Wide Choice of Materials for MCMs

论述了微波多芯片模块（MMCM）技术的发展历史、应用领域及工艺进展。

The history , application fields and advancement of microwave multi chip module ( MMCM ) technology are introduced .

模拟器为高速数字集成电路及高速多芯片模块高速互连的研究和设计提供了强有力的CAD工具和新的概念及方法。

The simulator is useful for the design of highspeed connection in IC and MCM .

这种挑战使得多芯片模块（MCM）成为必然的选择。

This challenge makes multichip module ( MCM ) a necessity .

此外，它还分别使用双芯片模块（DCM）和多芯片模块（MCM）作为其中端服务器和高端服务器的基本构建块。

Further , it uses Dual Chip Modules ( DCMs ) and Multi-Chip Modules ( MCMs ) as the basic building blocks for its mid-range and high-end servers , respectively .

多芯片模块二维互联线分布电感电阻参数提取算法

Distributed inductance and resistance parameter extraction of 2D multi chip module interconnection

光电多芯片模块及其在高速计算机和光通信网络中的应用

Optoelectronic Multichip Modules and Its Application in High-speed Computer and Optical Communication Networks

微波多芯片模块技术

Technology of microwave multichip module

最后，深入研究了制作白光HB-LED整个封装工艺过程，制备出单芯片和多芯片HB-LED模块的样品，在一定散热制冷条件下，做了发光以及散热等相关测试和分析。

Finally , we deeply studied the whole process of packaging white HB LED device , and fabricated some samples of single-chip and multi-chip HB-LED device . We also made related thermal dissipation and lighting tests and analyses , under some cooling conditions .

介绍了微机电（MEMS）封装技术，包括晶片级封装、单芯片封装和多芯片封装、模块式封装与倒装焊3种很有前景的封装技术。

The technologies of MEMS packaging are introduced , including three promising technologies : wafer level packaging , single-chip packaging and multi-chip packaging , modular MEMS packaging and flip-chip bonding for MEMS packaging .

其次，介绍传热学理论基础以及目前高效的芯片制冷技术，建立多芯片阵列集成冷却模块的热学模型并进行参数分析。

Thirdly , we introduced fundamentals of heat transfer theory , presented the prevailing chip-cooling technologies with high efficiency . A thermal modeling and parameters analysis of multi-chips array package integrated with an innovative micro-channel cooling module was fully investigated .