固晶机
- 网络Die Bonder;Led Die Bonder;Clip die bonder
固晶机
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在半导体封装产业中,固晶机的吸晶装置起到非常重要的作用,如何实现吸晶工艺稳定、高质量保证和高效率协同是一个重要课题。
In semiconductor packaging industries , the pick-up process of die bonder is very important , how to realize the high stability , high quality and efficient coordination of pick-up process parameters is an important subject .
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基于DSP的固晶机伺服控制器的研究
Study of Die Bonder Servo Controller Based on DSP
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LED固晶机是LED产业中关键的封装设备之一,固晶过程的效率和质量是衡量其性能主要的参数。
LED die-bonder is one of the packaging equipment for the LED industry , the process efficiency and quality is a measure of its performance parameters .