印章材料

中国印章石的材料与资源研究

Materials and resources of Chinese signet stones

分析剪切位移对印章/微纳米材料界面能量释放率的影响。

The effect of displacement on the stamp / micro-nano materials interface and transfer printing is analyzed .

目前，转印的研究主要对印章/微纳米材料界面的分层进行分析，往往忽略微纳米材料/基体界面对转印的影响。

At present , the research of transfer printing mainly focuses on the fracture of the stamp / micro-nano materials interface , and the influence of micro-nano material / substrate interface is always ignored .

转印过程中，印章、微纳米材料和基体组成三明治结构，包括印章/微纳米材料和微纳米材料/基体两个界面，界面的分层是影响转印成功的关键。

In the process of transfer printing , the stamp , micro-nano material and substrate compose a model of sandwich structure , which includes two interfaces : stamp / micro-nano materials interface and micro-nano material / substrate interface .

柱状结构印章表面具有微结构时，印章与微纳米材料界面不连续，微结构会影响转印过程。

When the microstructure on the surface of post structured stamp exists , the stamp / micro-nano materials interface is discontinuous .