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fr4

fr4fr4
  1. New failure modes like FR4 substrate crack arise .

    出现印刷电路板开裂等新失效模式。

  2. Textile glass fabrics for surfacing FR4 : Flame Retardent laminate made from woven glass fiber material impregnated with epoxy resin .

    玻璃纤维表面涂覆材料用浸渍环阳树脂的玻纤布制成的阻燃积层板。

  3. To investigate the sensor packaging effect , the finite element method is adopted for analyzing the distribution of residual stress in the multi-sensor chip with FR4 substrates .

    针对集成传感器芯片封装粘贴过程中的残余应力影响器件性能的问题,使用有限元方法对环氧粘胶粘贴集成传感器芯片产生的封装残余应力进行了分析。

  4. When C / N is 5 , the pH is 7 ( FW3 and FR4 ) or 8 ( FW6 ) and the temperature is 30 ℃, the accumulation of NO ~ - _ 2 - N is low ;

    当C/N为5、pH值为7(FW3和FR4)或8(FW6)、温度为30℃时,3株菌的亚硝酸盐积累较小;