e51

Study on the Wear Resistance of MWCNTs / E51 Composite Coating

MWCNTs/E51复合涂层的耐磨性能研究

Preparation and performance of epoxy resin film using RFI process based on E51 / BF3-400 system

基于E51/BF3-400体系的RFI工艺用环氧树脂膜的制备与性能

The epoxy resin E51 and acrylic acid are used to synthesize UV curing EA resins .

环氧树脂和丙烯酸在适宜条件下合成EA树脂。

The nonequilibrium thermodynamic fluctuation theory was used to predict the cure behavior of T31-epoxy E51 system .

用非平衡态涨落理论也成功地预估了T（31）-环氧树脂体系的固化行为。

UV-curing epoxy acrylate abrasion resistant coatings was prepared by esterification of epoxy resin E51 and E44 with acrylic acid .

以E51和E44环氧树脂和丙烯酸为原料，制备了UV固化环氧丙烯酸酯耐磨涂料。

New HLX-1 Resin Curometer has been designed and built , by which the curing conditions of T31-epoxy resin E51 system was optimized .

在新设计制造的HLX-1型树脂固化仪上对T（31）-环氧树脂E51进行了最佳配方和最佳条件的选择。

The encapsulate composite for pulsed piezoelectric power supplier was investigated in this paper , in which a bisphenol A liquid epoxy EP828 / E51 was resin matrix and aluminum oxide was filler .

本论文研究的复合封装材料以双酚A型环氧树脂EP828／E51作为基体，以氧化铝作为填充材料，有望替代纯环氧固化物作为脉冲压电电源用新型封装材料。

The electroconductive adhesive is composed of epoxy resin ( E51 )、 copper powder and a small amount additive , Its curing temperature is at 100 ℃, Its resistivity is ≤ 3.6 × 10-3 Ω· cm . The adhesive can be applied for electron industry .

一种铜粉导电胶，由E51环氧树脂、密胺-脲醛树脂MF，铜粉及少量添加剂组成，固化温度为100℃，体积电阻率≤3.6×10-3Ω·cm，该导电胶可应用在电子工业中。