TSV

TSV ( Through Silicon Via ) is a new interconnected technology that used in high density 3-dimensional packaging .

硅通孔（ThroughSiliconVia，TSV）技术是一种应用于高密度三维封装中的新兴互连技术。

Among them , TSV is a very key process .

TSV的形成是其中很关键的一个工序。

Considered factors of the cost , precision control and so on , dry process is generally used to fabricate TSV .

考虑到成本，精度控制等因素，一般倾向于使用干法刻蚀来制作TSV。

TSV technology mostly used the ICP-RIE process , and using MEMS technics in future main packaging would speed up MEMS industry .

TSV技术主要采用ICP-RIE工艺，将MEMS技术应用于未来的主流封装技术将会进一步加快MEMS产业的速度。

Trionyx sinensis virus ( TSV ) was isolated from the lethal disease Chinese soft-shelled turtle .

中华鳖病毒（TSV）是从病鳖中分离到的一种病毒病原。

Using the RT-PCR technique , TSV was detected in 85 of 320 clinical cultivated penaeid shrimps in Guangxi .

应用RT-PCR对320份分别来自广西沿海不同对虾养殖场的对虾样品进行检测，结果一共有85份检出TSV。

This article will review today 's challenges , along with such future trends as integration and through-silicon via ( TSV ) technologies .

概述当今的挑战，以及这些集成和硅通孔技术的未来趋势。

From the viewpoint of crosstalk prevention , both the ways of substrate and TSV grounding are more effective than spacing .

从串音干扰预防的观点来看，无论是基板接地或是GroundTSV的方式皆比使用间距来的有效。

By the conjunction of the corresponding segmented T-model of TSV , they are combined to construct the electrical equivalence under coupling analysis .

相对应的TSVmodel也被等效均匀切割，它们结合起来去建构等效的模型来分析耦合效应。

Spreadsheets , such as the comma separated values format ( . csv ), tab separated values format ( . tsv ) .

电子表格，例如逗号分隔格式（.csv），项目分隔格式（.tsv）。

The acute disseminated intravascular coagulation ( dic ) induced by Trimeresurus stejnegeri venom ( tsv ) in rabbits

竹叶青蛇毒对家兔引起的急性播散性血管内凝血（DIC）的实验研究

Experimental results showed that TSV can be regarded as gender recognition characteristics in long range video images , which embodies robustness to be excellent for gender recognition under multi-view variations .

实验结果表明TSV特征可以作为远距离视频图像中的性别特征，并且该特征对多视角变化下的性别识别具有良好的鲁棒性。

Driven by the high-performance computing and the miniaturization of electronic devices , Through Silicon Vias ( TSV ) 3D packing technology becomes a key technology in chip interconnect .

受高性能计算和电子器件小型化的驱动，硅通孔（ThroughSiliconVias，TSV）工艺成为3D封装中芯片垂直互连的关键技术。

As to increase the Through-Silicon-Via ( TSV ) density in the three-dimensional chip integration , the quality of signal transmission may be problem on the two signals interfering with each other .

随著三维晶片里的矽穿孔密度增加，两讯号互相干扰将会造成讯号的传输品质发生问题。

The influence of copper flange pad and shape of solder joint on the reliability were analyzed . The results showed the lower copper flange height leads to a more reliable TSV .

研究了TSV焊盘高度和焊球形状对其可靠性的影响，结果表明焊盘高度越小，可靠性越高。

Nguyen began gymnastics at the age of four , and at seven joined TSV Unterhaching . Since 1995 , he has trained in the regional training center in Munich .

四岁开始练习体操，7岁加入拜仁州的TSVUnterhaching运动俱乐部。1995年开始，他在慕尼黑国家竞赛中心一直接受教练KurtSzilier的训练。

The methods of3D interconnection can be classified into the wire bonding , flip chip , through silicon via ( TSV ) and film wire technology , whose advantages and disadvantages are analyzed .

将实现3D互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。

With hypsography became low , the ratio between TSV and the service value of natural resource increased , which could be explained as : with hypsography becoming low , more and more natural resource was exploited ;

从小流域各高程段总体TSV与自然资源服务价值的比值关系看，随地势降低，这一比值增加，说明自然资源的开发利用程度越来越高；

Another approach might be to export the dataset into a particular format , such as JSON , CSV , TSV , or ATOM , so it can be consumed by an application for use .

另一个方法是将数据以特定的格式输出，例如SON、CSV、TSV或ATOM，使其可以为一个应用程序所使用。

If we implement the win-win ecological compensation model strategy , the economy development between 2002 to 2006 and between 2040 to 2050 will be totally different . The characteristics of TSV and GDP from ecological resource transform are absolutely different .

实施多赢生态补偿模式策略后，2002至2006年之间与2040至2050年之间呈现完全不同经济发展方式，生态资源转化的TSV和GDP的特征绝然不同。

The subjective estimates of TSV and TCV proved that the winding compensation of the simulating natural airflow make people achieve the thermal comfort more easily under the temperature conditions of 27C and 29C .

通过TSV和TCV的主观评价表明，在27℃与29℃的两种热环境工况中，模拟自然风气流的吹风补偿更易使人接近或实现热舒适状念。

Electromagnetic transport measurements show that the thermal stability behavior for NiO being on the top of the spin valve ( TSV ) is different from that for NiO being under the bottom of the spin valve ( BSV ) .

电磁输运测量表明，对相同Co/Cu/Co结构的自旋阀，NiO在自旋阀的顶部（TSV）和在自旋阀的底部（BSV）表现了不同的磁电阻值和热稳定特性。