PQFP

Optimization of Test Profile and Feasibility Analysis of Defect Activation for PQFP

基于PQFP的试验剖面优化与缺陷激发效果分析

At last , compared the measured data with prediction for the warpage of PQFP IC .

最后对塑料四边引线扁平封装（PQFP）IC翘曲的测量值与预测值进行比较。

This paper analyzes rules of moisture diffusion in PBGA and PQFP packages and influence of temperature during dry baking using finite element analysis models .

文章针对实际的PBGA和PQFP器件，利用有限元模型分析了烘烤过程中湿气扩散随时间变化的规律，以及温度对烘烤效果的影响。

The steady thermal performance of PQFP was studied under harsh environment , and factors effecting on the inner and outer thermal resistances were analyzed .

对PQFP在机载恶劣环境下的稳态热性能进行了研究，分析了影响元件内、外热阻的各种因素。

Results show that using the multi-layer structure is a perfect way to improve the thermal performance , and forced air velocity around the PQFP should be lower than 5m / s.

结果表明，内部采用多层结构设计是改善PQFP元件热性能的最佳方案，而在采用强迫空气冷却时，空气速度不应大于5m/s。

The numerical detailed model and compact model were created for plastic quad flat package ( PQFP ), and the accuracy of two models was verified by the measurement values .

建立了四边引线塑料扁平封装（PQFP，PlasticQuadFlatPackage）数值热模拟的详细模型和简化模型，实验验证了这两种模型的模拟精度。

This paper is mostly studying and analyzing moisture-induced cracking of surface mount packages ( SOP , PLCC , PQFP , PBGA etc. ) under specified reflow soldering conditions , and put forward some corresponding countermeasures .

本文主要对表面安装型塑封体（如SOP、PLCC、PQFP、PBGA等）在回流焊时吸湿开裂机理以及相应对策等进行讨论分析。