芯片载体

中国第一代用于LSI的无引线陶瓷芯片载体

The First Generation Leadless Ceramic Chip Carrier for LSI in China

芯片载体组装应用

Chip Carrier Packaging Applications

使用无引线陶瓷芯片载体（LCCC）可以达到高密度封装。

High density packaging can he achieved by using leadless ceramic chip carriers ( LCCCs ) .

普通印制板（PWB）对于无引线陶瓷芯片载体不是满意的基板，因为热膨胀系数（TCE）不匹配能引起铅焊处开裂。

Conventional printed wiring boards ( PWBs ) are not satisfactory substrates for LCCCs because the mismatch in thermal coefficient of expansion ( TCE ) causes solder joints to crack .

针对不同的芯片载体和生物反应的不同要求，出现了许多不同的载体表面处理方法。

Different treatment with carrier surface has appeared for different carrier and reaction condition respectively .

研制的小型无铅芯片载体封装便于大规模生产探测器，主要用途为便携式摄像机或头盔摄像机。

A small LCC package has been developed enabling a mass production of detectors for compact hand held or helmet mounted cameras .

因此，在集成电路金属连接线的制备以及在开发新的生物芯片载体材料等方面有着十分重要的应用。

Electroless plating method is showing advantages in the fabrication of metal interconnect of integrated circuit and in the development of new substrates for biochip .

随着Linux系统的不断升级换代，现在出现了以ARM芯片为载体，以Linux系统为软件平台设计出的新一代监控系统。

With the Linux system constantly upgrading and updating , and now appeared to ARM chip carrier and Linux systems software platform designed for a new generation of monitoring system .

采用FPGA芯片作为载体，使用EDA开发工具，用硬件描述语言实现不同的硬件逻辑，再与硬件的输入输出接口线路相连，最终组成一台可用于组成实验教学的完整计算机系统。

By using FPGA chips as a carrier , applying the EDA development tools , implementing different hardware logic with hardware description language , and connecting with the input and output hardware interface circuits , a comprehensive computer system for the composition principles experiments is completed .

介绍了一种以大规模可编程逻辑芯片为设计载体，以硬件描述语言VHDL为设计输入，采用模块化单元构建系统，进行数字频率计设计与开发的新方法。

This paper introduces a kind of extensive programmable logic chip to be the design carrier , VHDL as design input method that could design and develop the digital cymometer by using modularization cell design system .

应用于USBKEY的加密安全芯片是解决证书载体的关键。

The encryption security chip applied to the USB Key is a good carrier of digital certificate .

在片内系统设计中采用FPGA芯片作为系统的载体，并着重对系统级芯片内部模块化设计进行了论述。

In the inside system design we use FPGA as the carrier of system and emphasis discuss modularization design of inside system .

本文论述了无人机大气数据测试系统的工作原理，论证适合其特点的总体方案，采用FPGA芯片作为系统的载体，并着重对系统级芯片内部模块化设计进行论述。

This paper introduces the principle of atmosphere data measurement system in pilotless aircraft , discusses the practical total project , uses FPGA die as the system carrier and introduced in detail the module design in external die in system level .

集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages .