盖片

处理方案主要包括骑缝切槽、水下灌浆、骑缝切V形槽、嵌压SR止水材料、粘贴SR防渗盖片等。

The treating schemes were included the followings : slotting across cracks , grouting under water , V-shaped slotting across cracks , caulking SR materials , pasting impervious SR cover sheet .

采用干法刻蚀，在玻璃基板上形成了Pt电极，然后在铂电极上甩了一层PDMS胶，与上盖片进行了键合。

Form the Pt electrode in glass substrate using dry etching . And then dump a layer of PDMS glue on the top of platinum electrode , and bond with the PDMS cover . 3 .

对PDMS基片和PDMS盖片进行紫外改性，键合了全PDMS微流控芯片。

UV modification was adopted on PDMS substrate and PDMS coverslip , and the entire PDMS microfluidic chip was bonded .

微芯片由一片带有铂电极的玻璃载玻片、一层PDMS薄膜和一片带有微沟道的PDMS盖片组成。

The microchip consists of a glass slide with integrated Pt microelectrodes , a PDMS insulating layer and a PDMS channel plate ( containing the microchannel ) .

采用软光刻法制作带有微反应腔和微通道的PDMA盖片。

Adopting soft lithography method , we make a PDMA cover piece with the reaction chamber and micro channel .

首先利用光刻方法在ITO玻璃上制作ITO电极，然后将其和玻璃盖片用双面胶粘合的方法制备了FFE芯片。

First , the ITO electrodes on the ITO glass were prepared by photolithography , and the chip FFE was assembled by bonding with a cover glass sheet using a double tape as a spacer .

该芯片和相同尺寸的盖片在160N和105℃条件下经过20min热压键合在一起，键合强度为0.85MPa。

It cost 57 minutes to finish the total length . Then the chip was bonded together with another cover chip at 105 , 160 N for 20 min.

采用SODA&LIME玻璃、水热法制备的压电薄膜和浇注成型的PDMS盖片，通过光刻、显影和除铬、湿法刻蚀、掩蔽层去除等微加工工艺，制作了无阀压电微泵。

SODA & LIME glass , PZT thin film by hydrothermal method and PDMS plate by casting moulding are together used to equip a valveless micropump . The processes of lithography , develop and dechromisation , wet etching and masking layer removing are investigated forthe micropump fabrication .

基于非牛顿流体理论，建立了盖片胶的平面扩散模型，使用有限元软件Adina，基于流体体积法进行运动界面追踪，对模型进行了模拟仿真，并与实验结果进行了对比验证。

Based on non-Newtonian fluid theory , the adhesive 's planar spreading model was founded , the finite element software Adina was employed to trace the moving interface based on the method of Volume of Fluid ( VOF ), and experiments were performed to validate the simulative results .

芯片与相同尺寸的盖片在105℃、160N、恒温20min条件下通过热压键合在一起，得到密闭性好的整体芯片。

The chip was bonded together with another same size cover chip under 105 ℃, 160N and holding time 20 min using hot bonding method . The bonded chip can seal micro fluid well and endure high pressure .

利用模拟空间热循环温度场设备对太阳能电池中石英玻璃盖片/硅橡胶粘合剂/硅晶片胶接结构进行了真空热循环试验（123～403K，10-5Pa）。

The vacuum thermal cycling tests ( 123 ~ 403K , 10 - 5 Pa ) were carried out on the bonding structure of quartz glass cover / silicon rubber adhesive / silicon crystalline in solar battery , using the system simulating the temperature filed of thermal cycling in space .

贴在屋顶上防屋顶等漏水的金属盖片。

Sheet metal shaped and attached to a roof for strength and weatherproofing .

玻璃盖片的厚度仅0.1毫米左右。

The product is only 0.1 millimeter thick .

0.5MeV质子对玻璃盖片未完全覆盖GaAs/Ge太阳电池的影响

5 MeV proton irradiation effects on gaas / ge solar cells covered with different glass area

在封口盖片的内部设有塑胶密封层。

A plastic sealing layer is arranged at the inner part of the sealing cover sheet .

为了使筒壳具有气密性，在圆孔附近的内壁，安置了盖片，并用密封胶密封。

Patches covering the holes were installed on the inner surfaces of shells and sealed with sealant .

空间用抗辐照玻璃盖片是一种用于太空飞行器上硅太阳能电池表面的防护材料。

Anti-irradiation Cover Glass for Astrospace is a protection material for silicon solar battery on Space Craft .

盖片胶封装虽然原理简单，但封装的要求却非常高。

Although the principle of the adhesive bonding is simple , the requirements of bonding are very strict .

抗辐照玻璃盖片的封装操作是空间太阳能电池方阵制造过程的重要环节。

The bonding of anti-irradiating coverglass is the important point in the manufacturing process of space solar cell array .

最后，采用室温键合技术，将带有微纳结构的基片与盖片封合成玻璃微-纳流控复合芯片。

Finally , the channel-structured glass substrate was sealed to a cover glass plate by using room temperature bonding technique .

采用激光加工方法和机械钻孔方法对玻璃盖片进行钻孔实验，对比两种加工实验结果，选择优化的钻孔方式。

Adopting laser cutting and mechanical drilling to carry out glass cover-chip experiments , two experimental results are compared to optimize the selection of drilling .

本实用新型一种液体检测试片，用于液体量测，其包含一基板、一中间层、一上盖片。

The utility model relates to a liquid test piece for measuring liquid , which comprises a base plate , an interlayer , and a top head piece .

用标准光刻腐蚀技术在石英基片上腐蚀泳道，清洗腐蚀好的基片和盖片后，在真空条件下实现键合。

Patterns of microchannel were fabricated through standard photolithography and etching on the quartz glass substrate . After bonding surfaces were rigorously rinsed , bonding was realized in vacuum ovens .

为了制得精确结构的聚合物芯片，采用硅工艺制作芯片硅模具，在热压工艺下完成微流控芯片的基片和盖片制作。

To ensure precise structure of polymer chips , silicon mould was first produced using silicon processing , then the cover and substrate of microfluidic chips was made using hot-embossing method .

提供了一种包装箱，该包装箱具有两组相对的侧面板，和经上棱线延伸设置在各侧面板的上缘上的盖片；

Provided is a packing box , which is provided with two groups of opposite side plates and cover sheets which are extended on the upper edge of each side plates through an upper ridge line ;

本文通过机器人技术与滴胶技术的结合，设计出一套太阳能电池自动封装系统，实现太阳能电池片的高精度定量喷涂和抗辐照玻璃盖片的非真空环境下的精确封装。

Based on the combining robotics and adhesive-dripping technology , the paper gives an automatic bonding system for solar cell , which can achieve higher precision with controlling the adhesive-dripping process and bonding automation in non-vacuum condition .

它利用杠杆原理，当喝水者倾斜杯子的瞬间，塑料套壳内的铁棒滚动时打开塑料盖片，喝水者即可喝水。

The utility model uses lever principle , when a drinker inclines a cup , the iron rod in the plastic jacket shell rolls to open the plastic cover sheet , and the drinker can drink water .

当喝水者放下或端平杯子时，套壳内的铁棒利用套壳底部的斜面滚动，塑料盖片复又自然盖住杯子。

When the drinker puts down or carries the cup , the iron rod in the jacket shell rolls using a slope on the bottom of the jacket shell , and the plastic cover sheet covers the cup naturally again .

提出了控制电池片胶层厚度的连续滴胶方法与机构，以及一种能实现薄形抗辐照玻璃盖片和空间太阳电池的自动封装方法与机构。

A method which can control the thickness of adhesive layer on the solar cell was put forward and the mechanism was designed . Another method which can achieve the auto-bonding between thin cover-glass and the space solar cell was studied and realized .

本文针对新型复合易拉盖中铝塑盖片成型要求提出了具有创新性的冲切热压工艺，论述了该工艺的工作原理、装置运动规律以及实现该工艺的传动设计。

The paper put forward the innovative heating mould technology contrapose the moulding request of aluminum foil - plastic top in the newfashioned composite easy - opened lid , and discusses the working principle ? movement rule and the design of transmission of the technology .