沉积反应

  • 网络deposition reaction
沉积反应沉积反应
  1. 结果表明:Cl-对铜沉积反应起去极化作用。glue对铜沉积反应起强极化作用。

    The results obtained indicate that Cl - has an action of unpolarization on copper deposition reaction , glue has an action of the intense polarization on copper deposition reaction .

  2. 对化学镀沉积反应活化能的实验测试表明,由于酸性镀液中采用pK值较低的乳酸作为络合剂,反应体系的活化能较低,镀速较高。

    The experimental analysis of activation energy of electroless deposition reaction shows that acidic bath reaction system possesses a low activation energy and a high deposition rate .

  3. 通过调节电沉积反应条件,在Si基体上制备了不同尺寸的花状Ag纳米结构。

    The flower-like Ag nanostructures was synthesized by changing the electrodeposition conditions .

  4. 通过以Ag纳米颗粒为模板的置换和沉积反应,制备了Ag/Pt双金属复合纳米颗粒。

    Bimatallic Ag / Pt nanoparticles were prepared based on Ag nanoparticle-mediated replacement and deposition reactions .

  5. Ta2O5在Si(100)表面原子层沉积反应机理的密度泛函研究

    Density Functional Theory Study on the Surface Reaction Mechanism of Atomic Layer Deposited Ta_2O_5 on Si ( 100 ) Surfaces

  6. 考察了反应时间和反应物浓度以及体系的pH值对还原沉积反应的影响,并采用XRD,XPS,SEM对所制备的粉体进行了表征。

    The reaction time , concentration and pH value are investigated and the prepared powders were characterized by means of XRD , XPS and SEM .

  7. 理论和实验研究结果表明:高炉喷补料中CO气体侵蚀的碳沉积反应依次由吸附、化学反应和扩散过程控制。

    The experiment results and theoretical analysis indicated that the carbon deposition of gunning refractories for blast furnace in pure carbon monoxide was rate-controlled by adsorption , chemical reaction and diffusion process respectively .

  8. Sb(Ⅲ)、Bi(Ⅲ)离子均使铜沉积反应交换电流密度减小,对铜沉积过程起极化作用;

    Sb (ⅲ) and Bi (ⅲ) ions , on the contrary , decreased the density of exchange current and had an action of polarization on the process of copper deposition .

  9. 本文根据热活化理论的电流密度一般式得到了交换电流表达式,计算了Fe和Ni电化学沉积反应的交换电流,计算值与实验值基本一致。

    A theoretically derived expression of the exchange current is presented by using the general expression of thermal activation theory . The calculated values of the exchange current of Fe and Ni electrodeposition are in agreement with the experimental ones .

  10. 本文用热力学方法研究了SiCl4-H2外延系统中的各种腐蚀反应和沉积反应。

    The various etching reactions and depositing reactions for SiCl_4-H_2 epitaxial system have been studied by thermodynamical method .

  11. Glue和(NH2)2CS的极化作用使铜沉积反应的峰电流密度降低,峰电势负移;

    The polarization action of glue and thiourea make peak current density of copper deposition reaction decrease and make peak potential shift to more negative direction .

  12. 当Cl-、glue、(NH2)2CS共存于电解液中时,既对铜沉积反应起强极化作用,又使铜沉积过程的极限电流降低。

    When Cl - , glue and ( NH 2 ) 2CS coexisted in electrolyte , they have an action of the intense polarization on copper deposition reaction and decrease the density of limit current .

  13. MH-Ni电池为固溶体反应,锂离子电池是典型的嵌入型电极反应,锂聚合物电池正极为嵌入型反应,负极为锂的溶解-沉积反应。

    Ni-MH battery was solid solution reaction . Li-ion battery has the typical intercalation electrode reaction . And the positive electrode and negative electrode of lithium polymer battery were intercalation reaction and dissolution-aggradation reaction respectively .

  14. 结果表明:当Cl-、Glue、(NH2)2CS单独存在于电解液中时,Cl-的去极化作用使铜沉积反应的峰电流密度增大;

    The ( results ) indicate that when Cl ~ - , glue and thiourea alone exists in the eletrolyte , the depolarization action ofCl ~ - make peak current density of copper deposition reaction increase .

  15. Sb3+和Bi3+均使铜沉积反应的交换电流密度i0减小,对铜沉积过程起极化作用;

    Sb 3 + and Bi 3 + ions decreases the density of exchange current of copper deposition reaction , and has an action of polarization on the process of copper deposition .

  16. 结果表明:铜沉积反应是不可逆的。

    The results showed the reaction of copper deposition was irreversible .

  17. 喜马拉雅的隆升及其沉积反应研究新进展

    New progress of the study on Himalaya uplift and its sedimentary response

  18. 化学气相沉积反应研究的量子化学方法及应用

    Quantum chemistry methods and their applications to CVD reaction system

  19. 混合电位的测量已经成为判断一些电沉积反应发生的可能性标准。

    Mixed potential measurement has become a criterion for the feasibility of electrodepositing process .

  20. 最终,在现配的底物溶液中进行酶催化银沉积反应。

    In the end , the enzyme-catalyzed silver deposition reacted in the present substrate solution .

  21. 金属有机化学气相沉积反应器技术及进展

    Technology of MOCVD Reactors and its Progress

  22. 一种高效沉积反应室的设计

    Design of High Efficient Chamber for Coating

  23. 反应机理研究表明:溶液中溴离子是电沉积反应能够进行的重要因素。

    The reaction mechanism research indicated that the bromine ion in the solution carry on important factor for electrodeposition .

  24. 量子化学方法在研究化学气相沉积反应体系的反应机理、动力学计算方面有很大的潜力。

    To study the reaction mechanism of CVD ( chemical vapor deposition ) reaction system , quantum chemistry methods are proved highly potential .

  25. 研究表明,这种奇特的现象是由断裂沉积物两端发生的共轭溶解-沉积反应造成的。

    The studies show that this novel phenomenon was caused by the conjugate electrodissolution and electrodeposition reactions taking place at two ends of the isolated segment of the deposit .

  26. 但铁、镍、锌离子几乎不影响电荷传递系数,不改变铜沉积反应机理。

    But Fe 2 + , Fe 3 + , Ni 2 + and Zn 2 + do not effect charge transfer coefficient and do not change electrochemical reaction mechanism of copper deposition .

  27. 对一般气相沉积反应器清洗而言,一体化氟气供应策略,对寻求低价取代方案的使用者而言,是最安全和稳定的供应方式。

    An integrated fluorine supply strategy has been demonstrated to be the most effective means of implementing a safe and reliable fluorine supply to users seeking a low-cost replacement for standard chamber clean chemistries .

  28. 具体内容包括:1.开发了一种新型的基于间接竞争模式的超灵敏的电化学免疫传感器。该传感器结合了酶的生物催化银沉积反应及银增强连续放大分析信号用于赭曲霉毒素A的检测。

    Combination of enzyme-catalyzed silver deposition and the nanoparticles enlarged further , a novel ultrasensitive , successive signal amplification electrochemical immunosensor based on an indirect competitive assay was developed for the determination of ochratoxin A ( OTA ) .

  29. 用线性电位扫描法研究了在准稳态条件下,As5+、Sb3+、Bi3+离子对酸性硫酸铜体系中阴极铜沉积反应动力学的影响。

    In this paper , we study the effect of As 5 + , Sb 3 + , Bi 3 + on kinetics of cathodic deposition of copper in acidified CuSO 4 system at quasi steady state condition by linear potential sweep method .

  30. 证明当硅电极表面具有单层吸附Ag+离子、表面单层吸附Ag+离子发生沉积反应、Ag+离子发生本体沉积时的开路电位-时间曲线有完全不同的特征。

    It was found that the Op t curves showed obvious difference for the different interface state such as the monolayer adsorption of Ag + ions , the electrode reaction of the monolayer deposited Ag + ions and the bulk deposition of Ag + ions .